EP3SE260F1152C4N vs EP3SE260F1152I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4N disebabkan oleh Intel dan EP3SE260F1152I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1152C4N | EP3SE260F1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Family | Stratix III (Enhanced) | — |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | 10,200 |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 450 MHz | — |
| Kemasan | 1152-ball FC-FBGA (flip-chip) | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Speed Grade | -4 (commercial temperature) | I3 (Industrial, speed bin 3) |
| Suhu Operasi | 0C to +85C (commercial, 'C' suffix) | -40C to +100C (Industrial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| Jenis Ingatan | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | Obsolete (per Xecor comparator) |
| Logic Elements | — | 255,000 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Maximum Fabric Frequency | — | 500 MHz |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |