EP3SE260F1152I4N vs EP3SE260F1152C4N Perbandingan
Perbandingan bersamaan detil EP3SE260F1152I4N dari Intel dan EP3SE260F1152C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152I4N | EP3SE260F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/O | 744 | — |
| DSP Blocks (18x18 multipliers) | 896 | — |
| Transceivers | 48 (up to 8.5 Gbps) | — |
| Core Voltage | 0.86 V | 1.1 V |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| Paket | 1152-ball FCBGA (35 mm x 35 mm) | 1152-ball FC-FBGA (flip-chip) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | -40C to +100C (Industrial) | 0C to +85C (commercial, 'C' suffix) |
| Speed Grade | 4 | -4 (commercial temperature) |
| Level MSL | 3 (168 hours) | — |
| Status RoHS | Compliant | — |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Tipe Memori | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |