EP3SE260F1152I4N vs EP3SE260F1152C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152I4N disebabkan oleh Intel dan EP3SE260F1152C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP3SE260F1152I4N | EP3SE260F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/O | 744 | — |
| DSP Blocks (18x18 multipliers) | 896 | — |
| Transceivers | 48 (up to 8.5 Gbps) | — |
| Core Voltage | 0.86 V | 1.1 V |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| Kemasan | 1152-ball FCBGA (35 mm x 35 mm) | 1152-ball FC-FBGA (flip-chip) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | -40C to +100C (Industrial) | 0C to +85C (commercial, 'C' suffix) |
| Speed Grade | 4 | -4 (commercial temperature) |
| Aras MSL | 3 (168 hours) | — |
| Status RoHS | Compliant | — |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Jenis Ingatan | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |