EP3SE260F1152I4N vs EP3SE260F1152C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I4N sa pamamagitan ng Intel at EP3SE260F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1152I4N EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1152I4N EP3SE260F1152C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Series Stratix III E Stratix III E
Logic Elements 255,000 —
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 —
Maximum User I/O 744 —
DSP Blocks (18x18 multipliers) 896 —
Transceivers 48 (up to 8.5 Gbps) —
Core Voltage 0.86 V 1.1 V
Process Technology TSMC 40 nm 65 nm CMOS
Packhaging 1152-ball FCBGA (35 mm x 35 mm) 1152-ball FC-FBGA (flip-chip)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Temperature na Operasyon -40C to +100C (Industrial) 0C to +85C (commercial, 'C' suffix)
Speed Grade 4 -4 (commercial temperature)
Level ng MSL 3 (168 hours) —
Tindminan RoHS Compliant —
Family — Stratix III (Enhanced)
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Maximum Operating Frequency — 450 MHz
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Uri ng Memory — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

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