EP3SE260F1517C4N vs EP3SE260F1517C3N Perbandingan
Perbandingan bersamaan detil EP3SE260F1517C4N dari Intel dan EP3SE260F1517C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517C4N | EP3SE260F1517C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Series | Stratix® III E | — |
| Family | Field-Programmable Gate Array (FPGA) | Stratix III E |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory | 16,672,768 bits | 16,672,768 bits (16.7 Mbits) |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/Os | 976 | — |
| Paket | 1517-BBGA, FCBGA | 1517-BBGA (FCBGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | 0°C to 85°C | — |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Maximum Transceiver Data Rate | 12.5 Gbps | 600 Mbps |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Process Technology | — | 65 nm TSMC low-power CMOS |
| Speed Grade | — | C3 (commercial) |
| Suhu Hubung Kerja | — | 0 C to +85 C (commercial) |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |