EP3SE260F1517C4N vs EP3SE260F1517C3N 比較
詳細並排比較 EP3SE260F1517C4N 由 Intel 與 EP3SE260F1517C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1517C4N | EP3SE260F1517C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 最後購買 |
| Series | Stratix® III E | — |
| Family | Field-Programmable Gate Array (FPGA) | Stratix III E |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory | 16,672,768 bits | 16,672,768 bits (16.7 Mbits) |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/Os | 976 | — |
| 封裝 | 1517-BBGA, FCBGA | 1517-BBGA (FCBGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | 0°C to 85°C | — |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Maximum Transceiver Data Rate | 12.5 Gbps | 600 Mbps |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Process Technology | — | 65 nm TSMC low-power CMOS |
| Speed Grade | — | C3 (commercial) |
| 工作接面溫度 | — | 0 C to +85 C (commercial) |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |