EP3SE260F1517I3G vs EP3SE260F1517C3N Perbandingan
Perbandingan bersamaan detil EP3SE260F1517I3G dari Intel dan EP3SE260F1517C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517I3G | EP3SE260F1517C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory Bits | 16,672,768 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Core Voltage | 1.1 V | — |
| User I/O Count | 976 | — |
| Paket | 1517-ball FC-FBGA (Flip-Chip BGA) | 1517-BBGA (FCBGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Node | 65 nm | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLL Count | 12 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Lead-Free / RoHS | Yes (RoHS compliant per DigiKey listing) | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Process Technology | — | 65 nm TSMC low-power CMOS |
| Speed Grade | — | C3 (commercial) |
| Suhu Hubung Kerja | — | 0 C to +85 C (commercial) |
| Status RoHS | — | Compliant |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |