EP3SE260H780I4 vs EP3SE260H780C4L Perbandingan
Perbandingan bersamaan detil EP3SE260H780I4 dari Intel dan EP3SE260H780C4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260H780I4 | EP3SE260H780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | 0.9 V (nominal) |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| Paket | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Suhu Kerja | -40C to +100C (industrial, 'I' grade) | — |
| Speed Grade | 4 | C4 (middle/slow tier) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free per datasheet) |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Suhu Hubung Kerja | — | 0C to +85C (commercial) |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |