EP3SE260H780I4N vs EP3SE260H780I4 Perbandingan

Perbandingan bersamaan detil EP3SE260H780I4N dari Intel dan EP3SE260H780I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260H780I4N EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260H780I4N EP3SE260H780I4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Family Stratix III Enhanced (Stratix III E) Stratix III Enhanced (Stratix III E)
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 10,200
User I/Os 488 —
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 450 MHz up to 450 MHz core / 717 MHz per Partstack record
Paket 780-pin FC-HFBGA (FCBGA) 780-ball FC-HFBGA (HBGA)
Package Dimensions 33 mm x 33 mm —
Ball Pitch [DATA_NEEDED: BGA ball pitch in mm] —
Suhu Kerja -40C to +100C (Industrial) -40C to +100C (industrial, 'I' grade)
Configuration Modes AS, PS, JTAG, FPP —
Boundary Scan IEEE Std. 1149.1 (JTAG) —
Status RoHS Compliant [DATA_NEEDED: RoHS compliance status]
Lead-Free Yes —
Moisture Sensitivity Level [DATA_NEEDED: MSL rating] —
Logic Cells — 255,000
Adaptive Logic Modules (ALMs) — approximately 203,200
Maximum User I/Os — 488
Embedded RAM (total) — approximately 14.4 Mbit (M9K/M144K blocks)
DSP Blocks — approximately 768 (18x18 multipliers)
Speed Grade — 4
Tipe Mounting — Surface Mount (BGA)
Configuration Schemes — JTAG, Passive Serial, Fast Passive Parallel, Active Serial

Spek dan Sumber

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