EP3SE260H780I4N vs EP3SE260H780I4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780I4N disebabkan oleh Intel dan EP3SE260H780I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260H780I4N | EP3SE260H780I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/Os | 488 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 450 MHz | up to 450 MHz core / 717 MHz per Partstack record |
| Kemasan | 780-pin FC-HFBGA (FCBGA) | 780-ball FC-HFBGA (HBGA) |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | [DATA_NEEDED: BGA ball pitch in mm] | — |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (industrial, 'I' grade) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Boundary Scan | IEEE Std. 1149.1 (JTAG) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Logic Cells | — | 255,000 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Speed Grade | — | 4 |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |