EP3SE260H780I4N vs EP3SE260H780I4 比較

詳細並排比較 EP3SE260H780I4N 由 Intel 與 EP3SE260H780I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260H780I4N EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N ⚠ 最後購買機會

規格比較

參數 EP3SE260H780I4N EP3SE260H780I4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family Stratix III Enhanced (Stratix III E) Stratix III Enhanced (Stratix III E)
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 10,200
User I/Os 488 —
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 450 MHz up to 450 MHz core / 717 MHz per Partstack record
封裝 780-pin FC-HFBGA (FCBGA) 780-ball FC-HFBGA (HBGA)
Package Dimensions 33 mm x 33 mm —
Ball Pitch [DATA_NEEDED: BGA ball pitch in mm] —
工作溫度 -40C to +100C (Industrial) -40C to +100C (industrial, 'I' grade)
Configuration Modes AS, PS, JTAG, FPP —
Boundary Scan IEEE Std. 1149.1 (JTAG) —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS compliance status]
Lead-Free Yes —
Moisture Sensitivity Level [DATA_NEEDED: MSL rating] —
Logic Cells — 255,000
Adaptive Logic Modules (ALMs) — approximately 203,200
Maximum User I/Os — 488
Embedded RAM (total) — approximately 14.4 Mbit (M9K/M144K blocks)
DSP Blocks — approximately 768 (18x18 multipliers)
Speed Grade — 4
安裝類型 — Surface Mount (BGA)
Configuration Schemes — JTAG, Passive Serial, Fast Passive Parallel, Active Serial

資料表與資源

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