EP3SE50F484I3N vs EP3SE50F484I4G Perbandingan

Perbandingan bersamaan detil EP3SE50F484I3N dari Intel dan EP3SE50F484I4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE50F484I3N EP3SE50F484I4G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III E Stratix III E
Logic Elements 47,500 47,500 LE
Number of LABs 1,900 —
Total Memory Bits 5,760,000 —
Maximum User I/O 296 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage VCC 0.9 V —
Auxiliary Voltage VCCAUX 1.1 V —
Process Technology 65 nm 40 nm low-power CMOS
Maximum Internal Frequency 500 MHz —
Speed Grade I3 (industrial, bin 3) 4
Suhu Kerja -40C to +100C (industrial) -40C to +100C (industrial)
Paket 484-pin FC-FBGA (flip-chip BGA) 484-Ball FCBGA (FineLine BGA)
Tipe Mounting Surface Mount (BGA) —
Lead-Free / RoHS Yes (N suffix) —
Configuration Method Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Multipliers (18x18) [DATA_NEEDED: number of 18x18 multipliers] —
Transceiver Count [DATA_NEEDED: number of embedded transceivers] Up to 12 (Stratix III E family)
Adaptive Logic Modules (ALMs) — 19,000 ALM
Embedded Memory — 5.49 Mbit
User I/Os — 296 I/O
Tegangan Pemuat Kerja — 1.1 V (core)
Gaya Mounting — SMD/SMT
Status RoHS — Compliant (lead-free 'G' suffix)
Level MSL — [DATA_NEEDED: MSL level]
External Memory Support — DDR3, DDR2, QDR II/II+

Spek dan Sumber

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