EP3SE50F484I3N vs EP3SE50F484I4G 比較

詳細並排比較 EP3SE50F484I3N 由 Intel 與 EP3SE50F484I4G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F484I3N EP3SE50F484I4G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E Stratix III E
Logic Elements 47,500 47,500 LE
Number of LABs 1,900 —
Total Memory Bits 5,760,000 —
Maximum User I/O 296 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage VCC 0.9 V —
Auxiliary Voltage VCCAUX 1.1 V —
Process Technology 65 nm 40 nm low-power CMOS
Maximum Internal Frequency 500 MHz —
Speed Grade I3 (industrial, bin 3) 4
工作溫度 -40C to +100C (industrial) -40C to +100C (industrial)
封裝 484-pin FC-FBGA (flip-chip BGA) 484-Ball FCBGA (FineLine BGA)
安裝類型 Surface Mount (BGA) —
Lead-Free / RoHS Yes (N suffix) —
Configuration Method Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Multipliers (18x18) [DATA_NEEDED: number of 18x18 multipliers] —
Transceiver Count [DATA_NEEDED: number of embedded transceivers] Up to 12 (Stratix III E family)
Adaptive Logic Modules (ALMs) — 19,000 ALM
Embedded Memory — 5.49 Mbit
User I/Os — 296 I/O
工作電源電壓 — 1.1 V (core)
安裝方式 — SMD/SMT
RoHS 狀態 — Compliant (lead-free 'G' suffix)
MSL 等級 — [DATA_NEEDED: MSL level]
External Memory Support — DDR3, DDR2, QDR II/II+

資料表與資源

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