EP3SE50F484I3N vs EP3SE50F484I4G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484I3N disebabkan oleh Intel dan EP3SE50F484I4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE50F484I3N EP3SE50F484I4G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III E Stratix III E
Logic Elements 47,500 47,500 LE
Number of LABs 1,900 —
Total Memory Bits 5,760,000 —
Maximum User I/O 296 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage VCC 0.9 V —
Auxiliary Voltage VCCAUX 1.1 V —
Process Technology 65 nm 40 nm low-power CMOS
Maximum Internal Frequency 500 MHz —
Speed Grade I3 (industrial, bin 3) 4
Suhu Operasi -40C to +100C (industrial) -40C to +100C (industrial)
Kemasan 484-pin FC-FBGA (flip-chip BGA) 484-Ball FCBGA (FineLine BGA)
Jenis Pemasangan Surface Mount (BGA) —
Lead-Free / RoHS Yes (N suffix) —
Configuration Method Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Multipliers (18x18) [DATA_NEEDED: number of 18x18 multipliers] —
Transceiver Count [DATA_NEEDED: number of embedded transceivers] Up to 12 (Stratix III E family)
Adaptive Logic Modules (ALMs) — 19,000 ALM
Embedded Memory — 5.49 Mbit
User I/Os — 296 I/O
Tegangan Pemberi Arus Operasi — 1.1 V (core)
Gaya Pemasangan — SMD/SMT
Status RoHS — Compliant (lead-free 'G' suffix)
Aras MSL — [DATA_NEEDED: MSL level]
External Memory Support — DDR3, DDR2, QDR II/II+

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