EP3SE50F484I4G vs EP3SE50F484I4L Perbandingan

Perbandingan bersamaan detil EP3SE50F484I4G dari Intel dan EP3SE50F484I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE50F484I4L EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE50F484I4G EP3SE50F484I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Waktu Pembelian Terakhir
Family Stratix III E Stratix III E
Logic Elements 47,500 LE —
Adaptive Logic Modules (ALMs) 19,000 ALM [DATA_NEEDED: ALM count]
Embedded Memory 5.49 Mbit 5,760 Kbit (5.625 Mbit)
User I/Os 296 I/O —
Tegangan Pemuat Kerja 1.1 V (core) —
Suhu Kerja -40C to +100C (industrial) —
Speed Grade 4 4 (slowest)
Gaya Mounting SMD/SMT —
Paket 484-Ball FCBGA (FineLine BGA) 484-ball FCBGA (FBGA-484)
Process Technology 40 nm low-power CMOS —
Status RoHS Compliant (lead-free 'G' suffix) Compliant
Level MSL [DATA_NEEDED: MSL level] MSL3 (per JEDEC J-STD-020, typical for FBGA-484)
Transceiver Count Up to 12 (Stratix III E family) —
External Memory Support DDR3, DDR2, QDR II/II+ —
Logic Elements (LE) — 47,500
Logic Array Blocks (LABs) — 1,900
Embedded Multipliers (18x18) — 384
Maximum User I/O — 296
Maximum Core Clock — 717 MHz (per third-party listing)
Rentang Suhu Kerja — Industrial (I): -40C to +100C junction
Process Node — 40 nm CMOS
Tipe Mounting — Surface Mount (BGA)
Tegangan Pemuat — Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook)
Configuration Method — Quartus II / EPCS serial / parallel
Lead-Free (Pb-free) — Yes (L suffix)

Spek dan Sumber

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