EP3SE50F780C4L vs EP3SE260H780C4L Perbandingan
Perbandingan bersamaan detil EP3SE50F780C4L dari Intel dan EP3SE260H780C4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F780C4L | EP3SE260H780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III E | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Embedded Memory | 5,760,000 bits | — |
| User I/Os | 488 | — |
| DSP Blocks (18x18 multipliers) | 304 (19x16) | — |
| Paket | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Process Node | 40 nm | — |
| Core Voltage | 1.1 V | 0.9 V (nominal) |
| Speed Grade | C4 (commercial, speed 4) | C4 (middle/slow tier) |
| Lead-Free (L suffix) | Yes | — |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG / Enhanced | — |
| Suhu Kerja | [DATA_NEEDED: full industrial/commercial grade] | — |
| Status RoHS | Compliant (lead-free) | Compliant (lead-free per datasheet) |
| Transceivers | [DATA_NEEDED: per Stratix III E variant] | Up to 24 multi-gigabit transceivers |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Logic Elements | — | 255,000 |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Suhu Hubung Kerja | — | 0C to +85C (commercial) |
| Tipe Mounting | — | Surface Mount (flip-chip BGA) |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |