EP3SE50F780I4LG vs EP3SE110F780I4L Perbandingan
Perbandingan bersamaan detil EP3SE50F780I4LG dari Intel dan EP3SE110F780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F780I4LG | EP3SE110F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III E | — |
| Family | Stratix III | Stratix III E |
| Logic Elements | 47,500 | 107,500 |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Embedded Memory | 5.49 Mbit | 8,936,448 bits (8.9 Mbit) |
| Maximum User I/Os | 488 | — |
| Paket | 780-ball FCBGA (FBGA-780) | 780-pin FC-FBGA (Flip-Chip BGA) |
| Operating Supply Voltage (Core) | 1.1 V | — |
| Tipe Mounting | Surface Mount | Surface Mount (FC-FBGA) |
| Rentang Suhu Kerja | -40 C to +100 C | — |
| Process Node | 65 nm | — |
| DSP Blocks | Yes (dedicated, count not in source data) | — |
| High-Speed Transceivers | Multi-gigabit, count not in source data | — |
| Lead-Free / RoHS | Yes (G suffix = Pb-free) | — |
| Packaging | Tray | — |
| Tipe Memori | Embedded SRAM block RAM | — |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Maximum Operating Frequency | — | 375 MHz |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 0.9 V |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Status RoHS | — | Compliant (per legacy Altera data) |
| Product Status | — | Not Recommended for New Designs (NRND) |