EP3SE50F780I4LG vs EP3SE110F780I4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780I4LG disebabkan oleh Intel dan EP3SE110F780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F780I4LG | EP3SE110F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III E | — |
| Family | Stratix III | Stratix III E |
| Logic Elements | 47,500 | 107,500 |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Embedded Memory | 5.49 Mbit | 8,936,448 bits (8.9 Mbit) |
| Maximum User I/Os | 488 | — |
| Kemasan | 780-ball FCBGA (FBGA-780) | 780-pin FC-FBGA (Flip-Chip BGA) |
| Operating Supply Voltage (Core) | 1.1 V | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (FC-FBGA) |
| Gambaran Suhu Operasi | -40 C to +100 C | — |
| Process Node | 65 nm | — |
| DSP Blocks | Yes (dedicated, count not in source data) | — |
| High-Speed Transceivers | Multi-gigabit, count not in source data | — |
| Lead-Free / RoHS | Yes (G suffix = Pb-free) | — |
| Packaging | Tray | — |
| Jenis Ingatan | Embedded SRAM block RAM | — |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Maximum Operating Frequency | — | 375 MHz |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 0.9 V |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Status RoHS | — | Compliant (per legacy Altera data) |
| Product Status | — | Not Recommended for New Designs (NRND) |