EP3SL200H780C2N vs EP3SL200H780C3N Perbandingan
Perbandingan bersamaan detil EP3SL200H780C2N dari Intel dan EP3SL200H780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C2N | EP3SL200H780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | — |
| User I/O Count | 488 | — |
| Embedded Memory Bits | 10,901,504 | 10,901,504 bits |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Speed Grade | C2 | C3 (commercial, -3 speed) |
| Transceivers | Per family capability - not specified for this OPN | 24 channels, up to 3.75 Gbps |
| Paket | 780-ball HBGA / FCBGA | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Package Code | PBGA780 / HBGA-780 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Lead Free | Yes | — |
| Status RoHS | Compliant | — |
| Process Node | — | 40 nm |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| DSP Blocks | — | 384 |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Level MSL | — | 3 |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |