EP3SL200H780C2N vs EP3SL200H780C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780C2N disebabkan oleh Intel dan EP3SL200H780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780C2N | EP3SL200H780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | — |
| User I/O Count | 488 | — |
| Embedded Memory Bits | 10,901,504 | 10,901,504 bits |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Speed Grade | C2 | C3 (commercial, -3 speed) |
| Transceivers | Per family capability - not specified for this OPN | 24 channels, up to 3.75 Gbps |
| Kemasan | 780-ball HBGA / FCBGA | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Package Code | PBGA780 / HBGA-780 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Lead Free | Yes | — |
| Status RoHS | Compliant | — |
| Process Node | — | 40 nm |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| DSP Blocks | — | 384 |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Aras MSL | — | 3 |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |