EP3SL200H780C2N vs EP3SL200H780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780C2N sa pamamagitan ng Intel at EP3SL200H780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780C2N | EP3SL200H780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | — |
| User I/O Count | 488 | — |
| Embedded Memory Bits | 10,901,504 | 10,901,504 bits |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Speed Grade | C2 | C3 (commercial, -3 speed) |
| Transceivers | Per family capability - not specified for this OPN | 24 channels, up to 3.75 Gbps |
| Packhaging | 780-ball HBGA / FCBGA | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Package Code | PBGA780 / HBGA-780 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Lead Free | Yes | — |
| Tindminan RoHS | Compliant | — |
| Process Node | — | 40 nm |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| DSP Blocks | — | 384 |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Level ng MSL | — | 3 |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |