EP3SL200H780C3N vs EP3SL200H780C2 Perbandingan
Perbandingan bersamaan detil EP3SL200H780C3N dari Intel dan EP3SL200H780C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C3N | EP3SL200H780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L (low-power) | — |
| Process Node | 40 nm | 65 nm |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 bits | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| Paket | 780-Ball FCBGA (HBGA), 29 x 29 mm | 780-BBGA, FCBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | [DATA_NEEDED: transceiver count for H780] |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | — |
| Suhu Kerja | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | [DATA_NEEDED: core voltage] |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | [DATA_NEEDED: I/O voltage] |
| Level MSL | 3 | [DATA_NEEDED: MSL level] |
| Lead-Free / RoHS | Yes | — |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | — |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Series | — | Stratix III L |
| LABs / CLBs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| User I/O Count | — | 488 |
| DSP Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Status RoHS | — | Compliant |
| Lead Free | — | Yes |