EP3SL200H780C3N vs EP3SL200H780C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780C3N disebabkan oleh Intel dan EP3SL200H780C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780C3N | EP3SL200H780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L (low-power) | — |
| Process Node | 40 nm | 65 nm |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 bits | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| Kemasan | 780-Ball FCBGA (HBGA), 29 x 29 mm | 780-BBGA, FCBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | [DATA_NEEDED: transceiver count for H780] |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | — |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | [DATA_NEEDED: core voltage] |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | [DATA_NEEDED: I/O voltage] |
| Aras MSL | 3 | [DATA_NEEDED: MSL level] |
| Lead-Free / RoHS | Yes | — |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | — |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Series | — | Stratix III L |
| LABs / CLBs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| User I/O Count | — | 488 |
| DSP Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Status RoHS | — | Compliant |
| Lead Free | — | Yes |