EP3SL200H780I4 vs EP3SL200H780C2 Perbandingan
Perbandingan bersamaan detil EP3SL200H780I4 dari Intel dan EP3SL200H780C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780I4 | EP3SL200H780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements (LE) | 200,000 | — |
| Logic Array Blocks (LABs) | 8000 | — |
| Embedded Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | 488 |
| DSP Multipliers (18x18) | 384 | [DATA_NEEDED: 18x18 multiplier count] |
| Voltage - Core Supply | 1.1 V | — |
| Process Technology | 65 nm CMOS | — |
| Package Type | 780-BBGA / FCBGA (FC-HFBGA) | — |
| Package Dimensions | 33 mm x 33 mm | — |
| Speed Grade | I4 (industrial) | — |
| Suhu Hubung Kerja | -40C to +100C (industrial) | — |
| Configuration Memory | SRAM-based, volatile | — |
| Status RoHS | Compliant | Compliant |
| Design Tool | Quartus II (legacy) / Quartus Prime | — |
| Logic Elements | — | 200,000 |
| LABs / CLBs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| Paket | — | 780-BBGA, FCBGA |
| Suhu Kerja | — | 0C to +85C (Commercial) |
| Tipe Mounting | — | Surface Mount |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Process Node | — | 65 nm |
| Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| Transceivers | — | [DATA_NEEDED: transceiver count for H780] |
| Lead Free | — | Yes |