EP3SL70F780C2N vs EP3SL70F780I3 Perbandingan
Perbandingan bersamaan detil EP3SL70F780C2N dari Intel dan EP3SL70F780I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SL70F780C2N | EP3SL70F780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Family | Stratix III L | Stratix III L |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | 2,699,264 bits |
| Embedded Memory Type | M9K blocks | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS, low-power variant | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Logic Performance | 600 MHz | — |
| Paket | 780-ball FC-FBGA (FineLine BGA) | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Pin Count | 780 | — |
| Speed Grade | C2 (commercial, -2 speed bin) | I3 (industrial) |
| Operating Temperature Grade | N suffix - standard commercial/other | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Maximum User I/O | — | 488 |
| Suhu Kerja | — | -40 C to +100 C (Industrial) |
| Process Node | — | 65 nm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |