EP3SL70F780C2N vs EP3SL70F780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C2N sa pamamagitan ng Intel at EP3SL70F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL70F780C2N | EP3SL70F780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix III L | Stratix III L |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | 2,699,264 bits |
| Embedded Memory Type | M9K blocks | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS, low-power variant | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Logic Performance | 600 MHz | — |
| Packhaging | 780-ball FC-FBGA (FineLine BGA) | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Pin Count | 780 | — |
| Speed Grade | C2 (commercial, -2 speed bin) | I3 (industrial) |
| Operating Temperature Grade | N suffix - standard commercial/other | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Maximum User I/O | — | 488 |
| Temperature na Operasyon | — | -40 C to +100 C (Industrial) |
| Process Node | — | 65 nm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |