EP3SL70F780C2N vs EP3SL70F780I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C2N disebabkan oleh Intel dan EP3SL70F780I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL70F780C2N | EP3SL70F780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix III L | Stratix III L |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | 2,699,264 bits |
| Embedded Memory Type | M9K blocks | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS, low-power variant | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Logic Performance | 600 MHz | — |
| Kemasan | 780-ball FC-FBGA (FineLine BGA) | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Pin Count | 780 | — |
| Speed Grade | C2 (commercial, -2 speed bin) | I3 (industrial) |
| Operating Temperature Grade | N suffix - standard commercial/other | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Maximum User I/O | — | 488 |
| Suhu Operasi | — | -40 C to +100 C (Industrial) |
| Process Node | — | 65 nm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |