EP4CE30F19A7N vs EP4CE30F19C7N Perbandingan
Perbandingan bersamaan detil EP4CE30F19A7N dari Intel dan EP4CE30F19C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE30F19A7N | EP4CE30F19C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV E | — |
| Logic Elements | 28,848 | 28,880 |
| Embedded Memory Bits | 608,256 (76 KB) | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 193 | — |
| Jumlah Pin | 324 | — |
| Paket | FBGA-324 (F19) | FBGA-256 (F19) |
| Process Technology | 60 nm | — |
| Core Voltage | 1.0 V / 1.2 V | 1.0 V (typical) |
| Embedded 18x18 Multipliers | 66 | 66 |
| General-Purpose PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Suhu Kerja | Automotive / Industrial grade | — |
| Configuration Modes | JTAG, Active Serial, Passive Serial | JTAG, AS, PS, FPP |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount | — |
| Speed Grade | 7 | -7 (fastest commercial) |
| Family | — | Cyclone IV E |
| Embedded Memory | — | 594 Kbits (M9K blocks) |
| Maximum User I/O | — | 329 |
| Temperature Grade | — | Commercial (0C to +85C junction) |
| Process Node | — | 60 nm low-power |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| External Memory Interface | — | DDR, DDR2, QDRII SRAM |
| Lead-Free | — | Yes |