EP4CGX110DF23I7N vs EP4CGX110CF23I7N Perbandingan
Perbandingan bersamaan detil EP4CGX110DF23I7N dari Intel dan EP4CGX110CF23I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX110DF23I7N | EP4CGX110CF23I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | 5,621,760 bits |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Suhu Kerja | -40C to +100C (industrial) | -40 °C to +100 °C (industrial, inferred from 'I') |
| Speed Grade | 7 | I7 (industrial, balance of speed and power) |
| Paket | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | FBGA-484 (484-pin FineLine BGA) |
| Package Code | BGA (FBGA) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Configurable Logic Blocks (CLBs / LABs) | — | 6,839 |
| User I/O Count | — | 270 |
| Supply Voltage (Core) | — | 1.2 V |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Maximum Operating Frequency | — | 472.5 MHz |
| Lead-Free / RoHS | — | Yes (N suffix) |