EP4CGX110DF23I7N vs EP4CGX110CF23I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX110DF23I7N disebabkan oleh Intel dan EP4CGX110CF23I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX110DF23I7N | EP4CGX110CF23I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | 5,621,760 bits |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Suhu Operasi | -40C to +100C (industrial) | -40 °C to +100 °C (industrial, inferred from 'I') |
| Speed Grade | 7 | I7 (industrial, balance of speed and power) |
| Kemasan | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | FBGA-484 (484-pin FineLine BGA) |
| Package Code | BGA (FBGA) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Configurable Logic Blocks (CLBs / LABs) | — | 6,839 |
| User I/O Count | — | 270 |
| Supply Voltage (Core) | — | 1.2 V |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Maximum Operating Frequency | — | 472.5 MHz |
| Lead-Free / RoHS | — | Yes (N suffix) |