EP4CGX110DF23I7N vs EP4CGX110CF23I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF23I7N sa pamamagitan ng Intel at EP4CGX110CF23I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX110DF23I7N | EP4CGX110CF23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | 5,621,760 bits |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Temperature na Operasyon | -40C to +100C (industrial) | -40 °C to +100 °C (industrial, inferred from 'I') |
| Speed Grade | 7 | I7 (industrial, balance of speed and power) |
| Packhaging | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | FBGA-484 (484-pin FineLine BGA) |
| Package Code | BGA (FBGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | — |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Configurable Logic Blocks (CLBs / LABs) | — | 6,839 |
| User I/O Count | — | 270 |
| Supply Voltage (Core) | — | 1.2 V |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Maximum Operating Frequency | — | 472.5 MHz |
| Lead-Free / RoHS | — | Yes (N suffix) |