EP4CGX50DF23I8N vs EP4CGX50DF23C8N Perbandingan
Perbandingan bersamaan detil EP4CGX50DF23I8N dari Intel dan EP4CGX50DF23C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX50DF23I8N | EP4CGX50DF23C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Process Technology | 60 nm | 60 nm |
| Core Voltage | 1.2 V | — |
| Paket | 484-ball FineLine BGA (FBGA) | 484-ball FBGA (DF23) |
| Package Code | F23 | — |
| Suhu Kerja | -40C to +85C (Industrial) | — |
| Temperature Grade | I8N (Industrial, Pb-free) | — |
| User I/O (max) | 364 | — |
| Embedded RAM | 234 Kbits (M9K blocks) | — |
| PLLs | 2 | — |
| Transceivers | Up to 8 (3.125 Gbps) | Up to 8 channels, 3.125 Gbps |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Multipliers | 18x18 dedicated DSP blocks | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (Pb-free) | Compliant |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Core Supply Voltage | — | 1.2 V |
| Ball Pitch | — | 1.00 mm |
| Seated Height | — | 2.40 mm |
| Terminal Form | — | Ball |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Modes | — | JTAG, Passive Serial, Active Serial |
| Level MSL | — | 3 (168 hours) |