EP4CGX50DF23I8N vs EP4CGX50DF23C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF23I8N sa pamamagitan ng Intel at EP4CGX50DF23C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CGX50DF23I8N EP4CGX50DF23C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV GX Cyclone IV GX
Logic Elements 49,888 49,888
Process Technology 60 nm 60 nm
Core Voltage 1.2 V —
Packhaging 484-ball FineLine BGA (FBGA) 484-ball FBGA (DF23)
Package Code F23 —
Temperature na Operasyon -40C to +85C (Industrial) —
Temperature Grade I8N (Industrial, Pb-free) —
User I/O (max) 364 —
Embedded RAM 234 Kbits (M9K blocks) —
PLLs 2 —
Transceivers Up to 8 (3.125 Gbps) Up to 8 channels, 3.125 Gbps
PCIe Hard IP Yes (Gen1/Gen2) —
Multipliers 18x18 dedicated DSP blocks —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS Compliant (Pb-free) Compliant
Configurable Logic Blocks (CLBs) — 3,118
Core Supply Voltage — 1.2 V
Ball Pitch — 1.00 mm
Seated Height — 2.40 mm
Terminal Form — Ball
Operating Temperature Grade — Commercial (0C to +85C)
Configuration Modes — JTAG, Passive Serial, Active Serial
Level ng MSL — 3 (168 hours)

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