EP4CGX50DF23I8N vs EP4CGX50DF23C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX50DF23I8N disebabkan oleh Intel dan EP4CGX50DF23C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX50DF23I8N | EP4CGX50DF23C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Process Technology | 60 nm | 60 nm |
| Core Voltage | 1.2 V | — |
| Kemasan | 484-ball FineLine BGA (FBGA) | 484-ball FBGA (DF23) |
| Package Code | F23 | — |
| Suhu Operasi | -40C to +85C (Industrial) | — |
| Temperature Grade | I8N (Industrial, Pb-free) | — |
| User I/O (max) | 364 | — |
| Embedded RAM | 234 Kbits (M9K blocks) | — |
| PLLs | 2 | — |
| Transceivers | Up to 8 (3.125 Gbps) | Up to 8 channels, 3.125 Gbps |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Multipliers | 18x18 dedicated DSP blocks | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (Pb-free) | Compliant |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Core Supply Voltage | — | 1.2 V |
| Ball Pitch | — | 1.00 mm |
| Seated Height | — | 2.40 mm |
| Terminal Form | — | Ball |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Modes | — | JTAG, Passive Serial, Active Serial |
| Aras MSL | — | 3 (168 hours) |