EP4SGX110DF29C3G vs EP4SGX70DF29C3G Perbandingan
Perbandingan bersamaan detil EP4SGX110DF29C3G dari Intel dan EP4SGX70DF29C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX110DF29C3G | EP4SGX70DF29C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 105,600 | — |
| Adaptive Logic Modules (ALMs) | 4,224 LABs | — |
| Total Memory Bits | 9,793,536 | — |
| User I/O Count | 372 | 372 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Package Pin/Ball Count | 780 | — |
| Tegangan Pemuat | 0.9 V core | — |
| Process Technology | 40 nm | — |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Transceiver Count | [DATA_NEEDED: number of transceivers] | — |
| DSP Blocks | 266 (18x18 multipliers) | Yes (variable-precision DSP) |
| Suhu Kerja | Commercial (0C to +85C) - per C3 grade suffix | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Tipe Mounting | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory (bits) | — | 7,564,880 |
| Core Voltage | — | 0.9 V |
| Paket | — | 780-BBGA, FCBGA (FineLine BGA) |
| Process Node | — | 40 nm |
| Transceivers | — | Up to 16 channels, 600 Mbps - 8.5 Gbps |
| PCIe Hard IP | — | PCIe Gen1/Gen2 endpoint |
| Operating Temperature Grade | — | Commercial (C suffix) |