EP4SGX110DF29C3G vs EP4SGX70DF29C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX110DF29C3G sa pamamagitan ng Intel at EP4SGX70DF29C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4SGX110DF29C3G EP4SGX70DF29C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Stratix IV GX Stratix IV GX
Family Stratix IV GX Stratix IV GX
Logic Elements 105,600 —
Adaptive Logic Modules (ALMs) 4,224 LABs —
Total Memory Bits 9,793,536 —
User I/O Count 372 372
Package Type 780-BBGA, FCBGA (Flip-Chip) —
Package Pin/Ball Count 780 —
Volte ng Pagbibigay 0.9 V core —
Process Technology 40 nm —
Transceiver Data Rate Up to 8.5 Gbps —
Transceiver Count [DATA_NEEDED: number of transceivers] —
DSP Blocks 266 (18x18 multipliers) Yes (variable-precision DSP)
Temperature na Operasyon Commercial (0C to +85C) - per C3 grade suffix —
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] Compliant
Uri ng Pagpapasok Surface Mount (Flip-Chip BGA) Surface Mount (BGA)
Manufacturer — Intel (formerly Altera)
Logic Elements (LE) — 72,600
Embedded Memory (bits) — 7,564,880
Core Voltage — 0.9 V
Packhaging — 780-BBGA, FCBGA (FineLine BGA)
Process Node — 40 nm
Transceivers — Up to 16 channels, 600 Mbps - 8.5 Gbps
PCIe Hard IP — PCIe Gen1/Gen2 endpoint
Operating Temperature Grade — Commercial (C suffix)

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