EP4SGX230DF29I3N vs EP4SGX70DF29C2XG Perbandingan
Perbandingan bersamaan detil EP4SGX230DF29I3N dari Intel dan EP4SGX70DF29C2XG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX230DF29I3N | EP4SGX70DF29C2XG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Family | Stratix IV GX | Stratix IV GX |
| Series | EP4SGX230 | — |
| Logic Elements | 228000 | — |
| Number of LABs/CLBs | 9120 | — |
| Number of Logic Elements/Cells | 228000 | — |
| Total RAM Bits | 17544192 | — |
| Number of I/O | 372 | — |
| Voltage - Supply | 0.87 V to 0.93 V | — |
| Suhu Kerja | -40C to +100C (TJ) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Paket / Case | 780-BBGA, FCBGA | — |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Programmable | Not Verified (per distributor listing) | — |
| Part Status | Obsolete | — |
| Status RoHS | Compliant (per distributor listing) | Compliant |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory | — | 7,564,880 bits |
| Maximum User I/O | — | 372 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Paket | — | 780-FBGA (29x29 mm) |
| Transceiver Speed | — | Up to 8.5 Gbps |
| Transceiver Count | — | [DATA_NEEDED: number of transceiver channels] |
| DSP Blocks (18x18 Multipliers) | — | 364 |
| Rentang Suhu Kerja | — | -40C to +85C (commercial) |
| Level MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |
| Tray Packaging | — | Yes |