EP4SGX230DF29I3N vs EP4SGX70DF29C2XG 比較
詳細並排比較 EP4SGX230DF29I3N 由 Intel 與 EP4SGX70DF29C2XG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4SGX230DF29I3N | EP4SGX70DF29C2XG |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | 啟用中 |
| Family | Stratix IV GX | Stratix IV GX |
| Series | EP4SGX230 | — |
| Logic Elements | 228000 | — |
| Number of LABs/CLBs | 9120 | — |
| Number of Logic Elements/Cells | 228000 | — |
| Total RAM Bits | 17544192 | — |
| Number of I/O | 372 | — |
| Voltage - Supply | 0.87 V to 0.93 V | — |
| 工作溫度 | -40C to +100C (TJ) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 封裝 / 外殼 | 780-BBGA, FCBGA | — |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Programmable | Not Verified (per distributor listing) | — |
| Part Status | Obsolete | — |
| RoHS 狀態 | Compliant (per distributor listing) | Compliant |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory | — | 7,564,880 bits |
| Maximum User I/O | — | 372 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| 封裝 | — | 780-FBGA (29x29 mm) |
| Transceiver Speed | — | Up to 8.5 Gbps |
| Transceiver Count | — | [DATA_NEEDED: number of transceiver channels] |
| DSP Blocks (18x18 Multipliers) | — | 364 |
| 工作溫度範圍 | — | -40C to +85C (commercial) |
| MSL 等級 | — | 3 (168 hours) |
| Lead-Free | — | Yes |
| Tray Packaging | — | Yes |