EP4SGX230HF35I4G vs EP4SGX70DF29I4G Perbandingan
Perbandingan bersamaan detil EP4SGX230HF35I4G dari Intel dan EP4SGX70DF29I4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX230HF35I4G | EP4SGX70DF29I4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 72,600 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Paket | 1152-ball FCBGA (HF35) | 780-BBGA, FCBGA (29x29 mm) |
| Suhu Kerja | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 0.93 V | 0.9 V |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Number of LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| Number of I/O | — | 372 |
| Process Technology | — | 40 nm |
| Speed Grade | — | I4 |
| Transceivers | — | Up to 8 multi-gigabit channels (per family) |
| DSP Multipliers (18x18) | — | 384 (per family) |
| User I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Lead-Free | — | Yes |