EP4SGX230HF35I4G vs EP4SGX70DF29I4G 比較
詳細並排比較 EP4SGX230HF35I4G 由 Intel 與 EP4SGX70DF29I4G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4SGX230HF35I4G | EP4SGX70DF29I4G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 72,600 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| 封裝 | 1152-ball FCBGA (HF35) | 780-BBGA, FCBGA (29x29 mm) |
| 工作溫度 | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 0.93 V | 0.9 V |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| RoHS 狀態 | Compliant | Compliant |
| 安裝類型 | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Number of LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| Number of I/O | — | 372 |
| Process Technology | — | 40 nm |
| Speed Grade | — | I4 |
| Transceivers | — | Up to 8 multi-gigabit channels (per family) |
| DSP Multipliers (18x18) | — | 384 (per family) |
| User I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Lead-Free | — | Yes |