EP4SGX230HF35I4G vs EP4SGX70DF29I4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX230HF35I4G disebabkan oleh Intel dan EP4SGX70DF29I4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX230HF35I4G | EP4SGX70DF29I4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 72,600 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Kemasan | 1152-ball FCBGA (HF35) | 780-BBGA, FCBGA (29x29 mm) |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 0.93 V | 0.9 V |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Number of LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| Number of I/O | — | 372 |
| Process Technology | — | 40 nm |
| Speed Grade | — | I4 |
| Transceivers | — | Up to 8 multi-gigabit channels (per family) |
| DSP Multipliers (18x18) | — | 384 (per family) |
| User I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Lead-Free | — | Yes |