EP4SGX360FF35I3N vs EP4SGX360FF35C2XN Perbandingan

Perbandingan bersamaan detil EP4SGX360FF35I3N dari Intel dan EP4SGX360FF35C2XN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP4SGX360FF35I3N EP4SGX360FF35C2XN
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Stratix IV GX —
Family Stratix IV GX Stratix IV GX
Logic Elements (LE) 353,600 —
Adaptive Logic Modules (ALM) 141,440 —
Embedded Memory (Bits) 23,105,536 —
Total RAM Blocks 564 (M20K blocks) —
User I/O Count 564 —
Number of LABs/CLBs 14144 —
Paket 1152-BBGA, FCBGA (35 mm body, 1 mm pitch) 1152-BBGA, FCBGA (Flip-Chip BGA)
Suhu Kerja -40 °C to +100 °C (Industrial) 0C to +85C (Commercial)
Supply Voltage Core 0.95 V (typical) —
Transceiver Data Rate Up to 8.5 Gbps —
Process Node 40 nm —
Tipe Mounting Surface Mount Surface Mount
Status RoHS Compliant Compliant
Logic Elements — 353,600
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
LABs/CLBs — 14,144
Embedded Memory (bits) — 23,105,536
Number of Logic Elements/Cells — 353,600
Total RAM Bits — 23,105,536
Number of I/O — 564
User I/O Banks — 12
Supply Voltage - Core — 0.9 V
Speed Grade — -2
Number of Transceivers — 24
Transceiver Data Rate (max) — 8.5 Gbps
DSP Multipliers (18x18) — 1,920 (estimated per family datasheet)
Process Technology — 40 nm TSMC
Lead-Free — Yes

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