EP4SGX360FF35I3N vs EP4SGX360FF35C2XN Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35I3N sa pamamagitan ng Intel at EP4SGX360FF35C2XN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4SGX360FF35I3N EP4SGX360FF35C2XN
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Stratix IV GX —
Family Stratix IV GX Stratix IV GX
Logic Elements (LE) 353,600 —
Adaptive Logic Modules (ALM) 141,440 —
Embedded Memory (Bits) 23,105,536 —
Total RAM Blocks 564 (M20K blocks) —
User I/O Count 564 —
Number of LABs/CLBs 14144 —
Packhaging 1152-BBGA, FCBGA (35 mm body, 1 mm pitch) 1152-BBGA, FCBGA (Flip-Chip BGA)
Temperature na Operasyon -40 °C to +100 °C (Industrial) 0C to +85C (Commercial)
Supply Voltage Core 0.95 V (typical) —
Transceiver Data Rate Up to 8.5 Gbps —
Process Node 40 nm —
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS Compliant Compliant
Logic Elements — 353,600
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
LABs/CLBs — 14,144
Embedded Memory (bits) — 23,105,536
Number of Logic Elements/Cells — 353,600
Total RAM Bits — 23,105,536
Number of I/O — 564
User I/O Banks — 12
Supply Voltage - Core — 0.9 V
Speed Grade — -2
Number of Transceivers — 24
Transceiver Data Rate (max) — 8.5 Gbps
DSP Multipliers (18x18) — 1,920 (estimated per family datasheet)
Process Technology — 40 nm TSMC
Lead-Free — Yes

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