EP4SGX360FF35I3N vs EP4SGX360FF35C2XN Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360FF35I3N disebabkan oleh Intel dan EP4SGX360FF35C2XN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP4SGX360FF35I3N EP4SGX360FF35C2XN
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Stratix IV GX —
Family Stratix IV GX Stratix IV GX
Logic Elements (LE) 353,600 —
Adaptive Logic Modules (ALM) 141,440 —
Embedded Memory (Bits) 23,105,536 —
Total RAM Blocks 564 (M20K blocks) —
User I/O Count 564 —
Number of LABs/CLBs 14144 —
Kemasan 1152-BBGA, FCBGA (35 mm body, 1 mm pitch) 1152-BBGA, FCBGA (Flip-Chip BGA)
Suhu Operasi -40 °C to +100 °C (Industrial) 0C to +85C (Commercial)
Supply Voltage Core 0.95 V (typical) —
Transceiver Data Rate Up to 8.5 Gbps —
Process Node 40 nm —
Jenis Pemasangan Surface Mount Surface Mount
Status RoHS Compliant Compliant
Logic Elements — 353,600
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
LABs/CLBs — 14,144
Embedded Memory (bits) — 23,105,536
Number of Logic Elements/Cells — 353,600
Total RAM Bits — 23,105,536
Number of I/O — 564
User I/O Banks — 12
Supply Voltage - Core — 0.9 V
Speed Grade — -2
Number of Transceivers — 24
Transceiver Data Rate (max) — 8.5 Gbps
DSP Multipliers (18x18) — 1,920 (estimated per family datasheet)
Process Technology — 40 nm TSMC
Lead-Free — Yes

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga