EP4SGX360HF35I3 vs EP4SGX360HF35I4 Perbandingan

Perbandingan bersamaan detil EP4SGX360HF35I3 dari Intel dan EP4SGX360HF35I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP4SGX360HF35I3 EP4SGX360HF35I4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Manufacturer Intel (formerly Altera) —
Series Stratix IV GX —
Family Stratix IV GX Field Programmable Gate Array Stratix IV GX
Logic Elements (LEs) 353,600 —
Total LABs 14,144 —
Embedded Memory (bits) 23,105,536 —
User I/Os 564 —
Core Voltage 0.9 V 0.9 V
Suhu Kerja -40 °C to +100 °C (Industrial) —
Package Type 1152-Ball FCBGA (FineLine BGA) —
Speed Grade F35 -4
Process Technology 40 nm —
I/O Standards Supported LVDS, LVTTL, LVPECL, HSTL, SSTL —
Embedded Transceivers Yes (multi-gigabit) —
DSP Blocks Yes (hard DSP blocks) —
Status RoHS Compliant Compliant
Configuration Modes Serial, Parallel, JTAG, Active Serial —
Tipe Mounting Surface Mount (BGA) —
Logic Elements — 353,600
Logic Array Blocks (LABs) — 14,144
Adaptive Logic Modules (ALMs) — 141,440
User I/O Pins — 564
Embedded Memory — 17,424 Kbits (23,130 Kbits total M9K + MLAB)
Embedded Multipliers (18 × 18) — 1,040 (per Mouser listing of Stratix IV GX family)
Transceivers — Up to 24 multi-gigabit transceivers (per Stratix IV GX family)
Transceiver Data Rate (max) — 8.5 Gbps
Paket — 1152-ball FCBGA (HF35, 35 × 35 mm)
Operating Temperature (junction) — -40°C to 100°C (I4 industrial grade)
Process Node — 40 nm TSMC
Configuration — AES-256 bitstream encryption, EPCS serial flash, JTAG, parallel flash

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