EP4SGX70DF29I3G vs EP4SGX70DF29C4G Perbandingan

Perbandingan bersamaan detil EP4SGX70DF29I3G dari Intel dan EP4SGX70DF29C4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP4SGX70DF29I3G EP4SGX70DF29C4G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Stratix IV GX Stratix IV GX
Process Technology 40 nm —
Logic Elements (LE) 72,600 72,600
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) 780-BBGA, FCBGA
Package Code DF29 BGA
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V —
Speed Grade -3 C4 (commercial)
Tipe Mounting Surface Mount (BGA) Surface Mount
Level MSL [DATA_NEEDED: MSL rating] —
Status RoHS Compliant Compliant
Bebas Halogen [DATA_NEEDED: halogen-free claim] —
Family — Stratix IV
Total Memory Bits — 7,564,880
User I/O Count — 372
Number of Transceivers — 8
Transceiver Data Rate (max) — 8.5 Gbps
Package Body Size — 29 mm × 29 mm
Ball Pitch — 1.0 mm
Process Node — 40 nm
Suhu Kerja — [DATA_NEEDED: Operating Temperature Range]

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