EP4SGX70DF29I3G vs EP4SGX70DF29C4G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX70DF29I3G sa pamamagitan ng Intel at EP4SGX70DF29C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP4SGX70DF29I3G EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro EP4SGX70DF29I3G EP4SGX70DF29C4G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Stratix IV GX Stratix IV GX
Process Technology 40 nm —
Logic Elements (LE) 72,600 72,600
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) 780-BBGA, FCBGA
Package Code DF29 BGA
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V —
Speed Grade -3 C4 (commercial)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS Compliant Compliant
Wala sa Halogen [DATA_NEEDED: halogen-free claim] —
Family — Stratix IV
Total Memory Bits — 7,564,880
User I/O Count — 372
Number of Transceivers — 8
Transceiver Data Rate (max) — 8.5 Gbps
Package Body Size — 29 mm × 29 mm
Ball Pitch — 1.0 mm
Process Node — 40 nm
Temperature na Operasyon — [DATA_NEEDED: Operating Temperature Range]

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