EP4SGX70DF29I3G vs EP4SGX70DF29C4G 比較

詳細並排比較 EP4SGX70DF29I3G 由 Intel 與 EP4SGX70DF29C4G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP4SGX70DF29I3G EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G ✓ 啟用中

規格比較

參數 EP4SGX70DF29I3G EP4SGX70DF29C4G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series Stratix IV GX Stratix IV GX
Process Technology 40 nm —
Logic Elements (LE) 72,600 72,600
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) 780-BBGA, FCBGA
Package Code DF29 BGA
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V —
Speed Grade -3 C4 (commercial)
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 [DATA_NEEDED: MSL rating] —
RoHS 狀態 Compliant Compliant
無鹵素 [DATA_NEEDED: halogen-free claim] —
Family — Stratix IV
Total Memory Bits — 7,564,880
User I/O Count — 372
Number of Transceivers — 8
Transceiver Data Rate (max) — 8.5 Gbps
Package Body Size — 29 mm × 29 mm
Ball Pitch — 1.0 mm
Process Node — 40 nm
工作溫度 — [DATA_NEEDED: Operating Temperature Range]

資料表與資源

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