EPM570F256C4 vs EPM570F256C3N Perbandingan

Perbandingan bersamaan detil EPM570F256C4 dari Intel dan EPM570F256C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EPM570F256C4 EPM570F256C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX II MAX II
Device Name EPM570 —
Logic Elements (LEs) 570 570
Maximum User I/O Pins 212 —
User Flash Memory 8 Kbits —
Pin-to-Pin Logic Delay (tPD) 4.5 ns (commercial -4 speed grade) —
Supply Voltage - Core (VCCINT) 1.8 V —
Supply Voltage - I/O (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V —
Programming Interface JTAG (IEEE 1149.1), in-system programmable JTAG (IEEE 1532 / IEEE 1149.1) + ISP
Suhu Kerja 0C to +85C (commercial) —
Paket 256-ball FineLine BGA (F256) 256-ball FBGA (FineLine BGA)
Tipe Mounting Surface Mount Surface Mount
Level MSL 3 (168 hours) [DATA_NEEDED: MSL level not stated in provided data]
Lead-Free / RoHS Yes (lead-free finish, RoHS compliant per product page) —
Configuration Memory Internal Flash (non-volatile, instant-on) —
Global Clock Networks 4 —
Equivalent Macrocells — 440
User Flash Memory (UFM) — 8 Kbits
Maximum Operating Frequency — 304 MHz
Process Technology — 0.18 um, 6-layer-metal flash CMOS
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
User I/O Count — [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
Status RoHS — Compliant (per DigiKey listing)
Lead-Free — Yes (per suffix 'N' convention)
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

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