EPM570F256C4 vs EPM570F256C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570F256C4 disebabkan oleh Intel dan EPM570F256C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570F256C4 | EPM570F256C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Device Name | EPM570 | — |
| Logic Elements (LEs) | 570 | 570 |
| Maximum User I/O Pins | 212 | — |
| User Flash Memory | 8 Kbits | — |
| Pin-to-Pin Logic Delay (tPD) | 4.5 ns (commercial -4 speed grade) | — |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Kemasan | 256-ball FineLine BGA (F256) | 256-ball FBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | 3 (168 hours) | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free / RoHS | Yes (lead-free finish, RoHS compliant per product page) | — |
| Configuration Memory | Internal Flash (non-volatile, instant-on) | — |
| Global Clock Networks | 4 | — |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Maximum Operating Frequency | — | 304 MHz |
| Process Technology | — | 0.18 um, 6-layer-metal flash CMOS |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Status RoHS | — | Compliant (per DigiKey listing) |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |